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1

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution

Seung-Hyun Chae,, Jie-Hua Zhao,, Edwards, D.R., Ho, P.S.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2010

Language:

english

File:

PDF, 1.40 MB

english, 2010

2

Packaging effects on reliability of cu/low-k interconnects

Guotao Wang,, Merrill, C., Jie-Hua Zhao,, Groothuis, S.K., Ho, P.S.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2003

Language:

english

File:

PDF, 7.51 MB

english, 2003

3

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Zhao, Jie-Hua, Gupta, Vikas, Lohia, Alok, Edwards, Darvin

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 475 KB

english, 2010

4

An Optical Method for Measuring the Two-Dimensional Surface Curvatures of Electronic Packages During Thermal Cycling

Du, Yong, Zhao, Jie-Hua, Ho, Paul

Journal:

Journal of Electronic Packaging

Year:

2001

Language:

english

File:

PDF, 74 KB

english, 2001

5

Microstructure-Based Stress Modeling of Tin Whisker Growth

Zhao, Jie-Hua, Su, Peng, Ding, Min, Chopin, Sheila, Ho, Paul S.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2006

Language:

english

File:

PDF, 1.97 MB

english, 2006

6

Application of virtual crack closure integral method for interface cracks in low-k integrated circuit devices under thermal load

Journal:

Engineering Fracture Mechanics

Year:

2005

Language:

english

File:

PDF, 558 KB

english, 2005

7

Dual stage modeling of moisture absorption and desorption in epoxy mold compounds

Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, Darvin Edwards

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 681 KB

english, 2012

8

L OW D IELECTRIC C ONSTANT M ATERIALS FOR ULSI I NTERCONNECTS

Morgen, Michael, Ryan, E. Todd, Zhao, Jie-Hua, Hu, Chuan, Cho, Taiheui, Ho, Paul S.

Journal:

Annual Review of Materials Science

Year:

2000

Language:

english

File:

PDF, 5.79 MB

english, 2000

9

ground states in quantum dots

Zhu, Jia-Lin, Zhao, Jie-Hua, Xiong, Jia-Jiong

Journal:

Physical Review B

Year:

1994

Language:

english

File:

PDF, 320 KB

english, 1994

10

Development of a Semi-nested PCR-Based Method for Specific and Rapid Detection of Alternaria solani Causing Potato Early Blight in Soil

Gu, Qing, Yang, Zhi-Hui, Zhao, Dong-Mei, Zhang, Dai, Wang, Qian, Ma, Li-Song, Zhu, Jie-Hua

Journal:

Current Microbiology

Year:

2017

Language:

english

File:

PDF, 792 KB

english, 2017

11

New constraints on the c retaceous geodynamics of paleo-Pacific plate subduction: I nsights from the Xiaojiang-Beizhang granitoids, Zhejiang Province, S outheast China

Liu, Liang, Hu, Rui-Zhong, Zhong, Hong, Tang, Yan-Wen, Yang, Jie-Hua, Li, Zhen, Zhao, Jiao-Long, Shen, Neng-Ping

Journal:

Year:

2018

Language:

english

File:

PDF, 34.41 MB

english, 2018

12

Low dielectric constant materials for advanced interconnects

Michael Morgen, Jie-Hua Zhao, Chuan Hu, Taiheui Cho, Paul S. Ho, E. Todd

Journal:

JOM Journal of the Minerals, Metals and Materials Society

Year:

1999

Language:

english

File:

PDF, 237 KB

english, 1999

13

Reliability issues for flip-chip packages

Paul S. Ho, Guotao Wang, Min Ding, Jie-Hua Zhao, Xiang Dai

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 1.65 MB

english, 2004

14

Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures

Jie-Hua Zhao, Wen-Jie Qi, Paul S Ho

Journal:

Microelectronics Reliability

Year:

2002

Language:

english

File:

PDF, 270 KB

english, 2002

15

Measurement of elastic modulus, Poisson ratio, and coefficient of thermal expansion of on-wafer submicron films

Zhao, Jie-Hua, Ryan, Todd, Ho, Paul S., McKerrow, Andrew J., Shih, Wei-Yan

Journal:

Journal of Applied Physics

Year:

1999

Language:

english

File:

PDF, 323 KB

english, 1999

16

Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests

Jie-Hua Zhao, Tellkamp, J., Gupta, V., Edwards, D.R.

Journal:

IEEE Transactions on Electronics Packaging Manufacturing

Year:

2009

Language:

english

File:

PDF, 1.52 MB

english, 2009

17

centers in spherical quantum dots

Zhu, Jia-Lin, Zhao, Jie-Hua, Duan, Wen-Hui, Gu, Bing-Lin

Journal:

Physical Review B

Year:

1992

Language:

english

File:

PDF, 220 KB

english, 1992

18

Structure-Property Correlation in Low K Dielectric Materials

Morgen, Michael, Zhao, Jie-Hua, Hay, Michael, Cho, Taiheui, Ho, Paul S.

Journal:

MRS Proceedings

Year:

1999

Language:

english

File:

PDF, 433 KB

english, 1999

19

A probabilistic mechanics approach to die cracking prediction in flip-chip ball grid array package

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2005

Language:

english

File:

PDF, 616 KB

english, 2005

20

A three-parameter Weibull-like fitting function for flip-chip die strength data

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 658 KB

english, 2004

21

Comparison of Crystalline Phase Transitions in Fluorniated vs Nonfluorinated Parylene Thin Films

Morgen, Michael, Rhee, Seung-Hyun, Zhao, Jie-Hua, Malik, Irfan, Ryan, Todd, Ho, Huei-Min, Plano, Mary Anne, Ho, Paul

Journal:

Year:

1999

Language:

english

File:

PDF, 104 KB

english, 1999

22

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Verification of ball-on-ring test using finite element analysis

Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.

Year:

2010

Language:

english

File:

PDF, 660 KB

english, 2010

23

[IEEE 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Lake Buena Vista, FL, USA (2011.05.31-2011.06.3)] 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) - Delamination prediction in lead frame packages using adhesion measurements and interfacial fracture modeling

Srinivasan, Venkat, Miller, Mikel, Gurrum, Siva, Zhao, Jie-Hua, Edwards, Darvin, Murtuza, Masood

Year:

2011

Language:

english

File:

PDF, 2.44 MB

english, 2011

24

Morphological Transitions in Fluorinated and Non-Fluorinated Parylenes

Morgen, Michael, Zhao, Jie-Hua, Rhee, Seung-Hyun, Ryant, E. Todd, Ho, Huei-Min, Plano, Mary Anne, Ho, Paul S.

Journal:

MRS Proceedings

Year:

1999

Language:

english

File:

PDF, 320 KB

english, 1999

25

[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Moisture diffusion and integrated stress analysis in encapsulated microelectronics devices

Fan, Xuejun, Jie-Hua Zhao,

Year:

2011

Language:

english

File:

PDF, 1.00 MB

english, 2011

26

[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - A probabilistic mechanics approach to die cracking prediction in flip-chip ball grid array package

Year:

2004

Language:

english

File:

PDF, 1.08 MB

english, 2004

27

Neuroprotective effects of ebselen are associated with the regulation of Bcl-2 and Bax proteins in cultured mouse cortical neurons

Jie-Hua Xu, Hai-Tao Hu, Yong Liu, Yi-Hua Qian, Zhao-Hui Liu, Qing-Rong Tan, Zhang-Jin Zhang

Journal:

Neuroscience Letters

Year:

2006

Language:

english

File:

PDF, 239 KB

english, 2006

28

Preparation and evaluation of a novel bonded imidazolium ionic liquid as stationary phase for gas chromatography

Dai, Jia-Ling, Zhao, Li-Hua, Shi, Jie-Hua

Journal:

Journal of Separation Science

Year:

2017

Language:

english

File:

PDF, 885 KB

english, 2017

29

Noninvasive model for predicting future ischemic strokes in patients with silent lacunar infarction using radiomics

Su, Jie-hua, Meng, Ling-wei, Dong, Di, Zhuo, Wen-yan, Wang, Jian-ming, Liu, Li-bin, Qin, Yi, Tian, Ye, Tian, Jie, Li, Zhao-hui

Journal:

BMC Medical Imaging

Year:

2020

File:

PDF, 1.47 MB

2020

30

Garnet geochemistry of tungsten-mineralized Xihuashan granites in South China

Yang, Jie-hua, Peng, Jian-tang, Hu, Rui-zhong, Bi, Xian-wu, Zhao, Jun-hong, Fu, Ya-zhou, Shen, Neng-Ping

Journal:

Year:

2013

Language:

english

File:

PDF, 1.63 MB

english, 2013

31

[AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: Seventh International Workshop on Stress-Induced Phenomena in Metallization - Austin, Texas (USA) (14-16 June 2004)] AIP Conference Proceedings - Simulation and Reliability Study of Cu/Low-k Devices in Flip-chip Packages

Year:

2004

Language:

english

File:

PDF, 586 KB

english, 2004

32

[AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: Tenth International Workshop on Stress-Induced Phenomena in Metallization - Austin (Texas) (5–7 November 2008)] AIP Conference Proceedings - Thermomechanical Property Characterization of Ultra Low-k Materials

Zhao, Jie-Hua, Gupta, Vikas, Mortensen, Clay D., Lu, Kuan-Hsun, Edwards, Darvin R., Johnson, David C., Ho, Paul S., Ho, Paul S., Zschech, Ehrenfried, Ogawa, Shinichi

Year:

2009

File:

PDF, 1.40 MB

2009

33

Inclusion interaction and effective material properties in a particle-filled composite material system

Siva P. Gurrum, Jie-Hua Zhao, Darvin R. Edwards

Journal:

Journal of Materials Science

Year:

2011

Language:

english

File:

PDF, 542 KB

english, 2011

34

An assessment of transgenomics as a tool for gene discovery in Populus euphratica Oliv.

Zhou, Jing, Liu, Xin, Zhao, Shu-Tang, Hu, Jian-Jun, Zhang, Jie-Wei, Wang, Jie-Hua, Peng, Xiao-Peng, Qi, Xiao-Li, Cheng, Tie-Long, Lu, Meng-Zhu

Journal:

Plant Molecular Biology

Year:

2018

Language:

english

File:

PDF, 3.81 MB

english, 2018

35

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Effect of backside scratch direction on the Si die strength

Chae, Seung-Hyun, Zhao, Jie-Hua, Edwards, Darvin R., Ho, Paul S.

Year:

2010

Language:

english

File:

PDF, 939 KB

english, 2010

36

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Microstructure-based stress modeling of tin whisker growth

Jie-Hua Zhao,, Peng Su,, Min Ding,, Chopin, S., Ho, P.S.

Year:

2005

Language:

english

File:

PDF, 809 KB

english, 2005

37

Gemini quaternary ammonium-incorporated biodegradable multiblock polyurethane micelles for brain drug delivery

Liang, Rui-Chao, Fang, Fang, Wang, Yan-Chao, Song, Ni-Jia, Li, Jie-Hua, Zhao, Cheng-Jian, Peng, Xing-Chen, Tong, Ai-Ping, Fang, Yuan, He, Min, You, Chao, Tan, Hong

Journal:

Year:

2015

Language:

english

File:

PDF, 1.51 MB

english, 2015

38

[IEEE ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - San Diego, CA, USA (30 May-1 June 2002)] ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) - Thermal deformation analysis on flip-chip packages using high resolution moire interferometry

Guotao Wang,, Jie-Hua Zhao,, Min Ding,, Ho, P.S.

Year:

2002

Language:

english

File:

PDF, 1.09 MB

english, 2002

39

[ASME ASME 2008 International Mechanical Engineering Congress and Exposition - Boston, Massachusetts, USA (October 31–November 6, 2008)] Volume 12: Mechanics of Solids, Structures and Fluids - Design Optimization of Material Properties in a Particle-Filled Composite Material System

Gurrum, Siva P., Zhao, Jie-Hua, Edwards, Darvin R.

Year:

2008

Language:

english

File:

PDF, 749 KB

english, 2008

40

[ASME ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability - San Francisco, California, USA (July 19–23, 2009)] ASME 2009 InterPACK Conference, Volume 1 - Effect of Viscoelasticity on Thermalmechanical Stress in Polymers

Pang, Yaoyu, Zhao, Jie-Hua, Edwards, Darvin

Year:

2009

Language:

english

File:

PDF, 121 KB

english, 2009

41

[IEEE 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Seattle, WA, USA (25-28 May 1998)] 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206) - Analysis and modeling verification for thermal-mechanical deformation in flip-chip packages

Jie-Hua Zhao,, Xiang Dai,, Ho, P.S.

Year:

1998

Language:

english

File:

PDF, 928 KB

english, 1998

42

Effect of chain extender on hydrogen bond and microphase structure of biodegradable thermoplastic polyurethanes

Liu, Wen-Kai, Zhao, Yun, Wang, Rong, Luo, Feng, Li, Jian-Shu, Li, Jie-Hua, Tan, Hong

Journal:

Chinese Journal of Polymer Science

Year:

2017

Language:

english

File:

PDF, 1.09 MB

english, 2017

43

miR-665 expression predicts poor survival and promotes tumor metastasis by targeting NR4A3 in breast cancer

Zhao, Xin-Ge, Hu, Jing-Ye, Tang, Jun, Yi, Wei, Zhang, Mei-Yin, Deng, Rong, Mai, Shi-Juan, Weng, Nuo-Qing, Wang, Rui-Qi, Liu, Ji, Zhang, Hui-Zhong, He, Jie-Hua, Wang, Hui-Yun

Journal:

Cell Death and Disease

Year:

2019

Language:

english

File:

PDF, 2.98 MB

english, 2019

44

Mechanical integrity evaluation of low-k device with bump shear

Peng Su, Jie-Hua Zhao, Scott Pozder, David Wontor

Journal:

Journal of Electronic Materials

Year:

2006

Language:

english

File:

PDF, 369 KB

english, 2006

45

Petrogenesis of the Mesozoic Shuikoushan peraluminous I-type granodioritic intrusion in Hunan Province, South China: Middle–lower crustal reworking in an extensional tectonic setting

Yang, Jie-Hua, Peng, Jian-Tang, Zheng, Yong-Fei, Hu, Rui-Zhong, Bi, Xian-Wu, Zhao, Jun-Hong, Huang, Jin-Chuan, Zhang, Bang-Lu

Journal:

Journal of Asian Earth Sciences

Year:

2016

Language:

english

File:

PDF, 4.78 MB

english, 2016

46

[IEEE 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Las Vegas, NV, USA (2010.06.2-2010.06.5)] 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - Packaging optimization to mitigate stress induced parameter shift in precision devices

Zhao, Jie-Hua, Gurrum, Siva, Edwards, Darvin

Year:

2010

Language:

english

File:

PDF, 965 KB

english, 2010

47

Thermal stress and glass transition of ultrathin polystyrene films

Zhao, Jie-Hua, Kiene, Michael, Hu, Chuan, Ho, Paul S.

Journal:

Applied Physics Letters

Year:

2000

Language:

english

File:

PDF, 300 KB

english, 2000

48

Simultaneous measurement of Young’s modulus, Poisson ratio, and coefficient of thermal expansion of thin films on substrates

Zhao, Jie-Hua, Du, Yong, Morgen, Michael, Ho, Paul S.

Journal:

Journal of Applied Physics

Year:

2000

Language:

english

File:

PDF, 280 KB

english, 2000

49

Thermomechanical properties and moisture uptake characteristics of hydrogen silsesquioxane submicron films

Zhao, Jie-Hua, Malik, Irfan, Ryan, Todd, Ogawa, Ennis T., Ho, Paul S., Shih, Wei-Yan, McKerrow, Andrew J., Taylor, Kelly J.

Journal:

Applied Physics Letters

Year:

1999

Language:

english

File:

PDF, 338 KB

english, 1999

50

Characterization of Poly(MAA-co-EDMA) Monolithic Column for High Performance Liquid Chromatography: Scanning Electron Microscopy, Thermodynamic Parameters and Linear Solvation Energy Relationship Methodology

Shi, Jie-Hua, Zhao, Li-Hua, Shen, Guo-Feng

Journal:

Journal of Chromatographic Science

Year:

2018

Language:

english

File:

PDF, 464 KB

english, 2018

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